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 FP7G75US60 Transfer Molded Type IGBT Module
July 2008
FP7G75US60
Transfer Molded Type IGBT Module General Description
Fairchild's New IGBT Modules ( Transfer Molded Type ) provide low conduction and switching losses as well as short circuit ruggedness. They are designed for applications such as Motor control, Uninterrupted Power Supplies (UPS) and general Inverters where short circuit ruggedness is a required feature.
Power-SPMTM
tm
Features
* Short Circuit rated 10us @Tc=100C, Vge=15V * High Speed Switching * Low Saturation Voltage : Vce(sat) =2.2V @Ic=75A * High Input Impedance * Fast & Soft Anti-Parallel FWD
Package Code : EPM7
1
Application
* Welders * AC & DC Motor Controls * General Purpose Inverters * Robotics * Servo Controls * UPS
3
2
4
5
6
7
Internal Circuit Diagram
Absolute Maximum Ratings
Symbol VCES VGES IC ICM (1) IF IFM TSC PD TJ Tstg Viso Mounting Torque Description Collector-Emitter Voltage Gate-Emitter Voltage Collector Current Pulsed Collector Current Diode Continuous Forward Current Diode Maximum Forward Current Short Circuit Withstand Time Maximum Power Dissipation Operating Junction Temperature Storage Temperature Range Isolation Voltage Power Terminals Screw : M5 Mounting Screw : M5 Rating 600 20 75 150 75 150 10 310 -40 to +125 -40 to +125 2500 2.0 2.0 Units V V A A A A us W C C V N.m N.m
@ TC = 25C @ TC = 100C @ TC = 100C @ TC = 25C
@ AC 1minute
(c)2008 Fairchild Semiconductor Corporation
1
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FP7G75US60 Rev. A
FP7G75US60 Transfer Molded Type IGBT Module
Pin Configuration and Pin Description
Top View
1
3
2
4
5
6
7
Internal Circuit Diagram
Pin Description Pin Number
1 2 3 4 5 6 7
Pin Description
Emitter of Q1, IGBT, Collector of Q2, IGBT Emitter of Q2, IGBT Collector of Q1, IGBT Gate of Q1, IGBT Emitter of Q1, IGBT Gate of Q2, IGBT Emitter of Q2, IGBT
FP7G75US60 Rev. A
2
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FP7G75US60 Transfer Molded Type IGBT Module
Electrical Characteristics (TJ = 25C,
Symbol Off Characteristics
BVCES BVCES/ TJ ICES IGES Collector-Emitter Breakdown Voltage
Unless Otherwise Specified)
Parameter
Conditions
Min Typ Max Units
VGE= 0V, IC = 250A
600 -
0.6 -
250 100
V V uA nA
Temperature Coeff. of Breakdown Voltage VGE= 0V, IC = 1mA Collector Cut-off Current Gate-Emitter Leakage Current VCE= VCES, VGE= 0V VGE= VGES, VCE= 0V
On Characteristics
VGE(th) VCE(sat) G-E Threshold Voltage Collector to Emitter Saturation Voltage VGE = 0V, IC=75mA IC = 75A, VGE = 15V 5.0 6.0 2.2 8.5 2.8 V V
Dynamic Characteristics
Cies Coes Cres Input Capacitance Output Capacitance Reverse Capacitance VCE = 30V, VGE = 0V, f = 1MHz 4515 550 100 -pF pF pF
Switching Characteristics
td(on) tr td(off) tf Eon Eoff Ets td(on) tr td(off) tf Eon Eoff Ets Tsc Qg Qge Qgc Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Short Circuit Withstand Time Total Gate Charge Gate-Emitter Charge Gate-Collector Charge VCE = 300 V, IC = 75A, VGE = 15V VCC = 300 V, VGE = 15V @ TC = 100C VCC = 300 V, IC = 75A, RG = 3.3, VGE = 15V Inductive Load, TC = 125C VCC = 300 V, IC = 75A, RG = 3.3, VGE = 15V Inductive Load, TC = 25C 10 33 29 92 91 0.75 0.72 1.47 27 22 96 197 0.73 1.47 2.2 205 40 115 ns ns ns ns mJ mJ mJ ns ns ns ns mJ mJ mJ us nC nC nC
FP7G75US60 Rev. A
3
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FP7G75US60 Transfer Molded Type IGBT Module
Electrical Characteristics of DIODE (TJ = 25C,
Symbol
VFM
Unless Otherwise Specified)
Parameter
Diode Forward Voltage IF = 75A
Conditions
TC = 25C TC = 100C TC = 25C
Min Typ Max Units
1.9 1.8 78 156 5.7 10 222 nC 780 7.5 A 2.8 V 112 ns
trr
Diode Reverse Recovery Time TC = 100C Diode Peak Reverse Recovery Current IF = 75A di / dt = 150 A/us TC = 25C TC = 100C TC = 25C Diode Reverse Recovery Charge TC = 100C
Irr
Qrr
Thermal Characteristics
Symbol
RJC RJC RCS Weight
Parameter
Junction-to-Case (IGBT Part, per 1/2 Module) Junction-to-Case (DIODE Part, per 1/2 Module) Case-to-Sink Weight of Module (Conductive grease applied)
Typ.
0.05 -
Max.
0.32 0.9 90
Units
C/W C/W C/W g
FP7G75US60 Rev. A
4
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FP7G75US60 Transfer Molded Type IGBT Module
Typical Performance Characteristics
Fig 1. Typical Output Characteristics
200
Fig 2. Typical Saturation Voltage Characteristics
200
IC, Collector Current[A]
20V
15V
IC, Collector Current[A]
160 120 80
12V
Common Emitter VGE = 15V TC = 25 C TC = 125 C
o o
160 120 80 40
V GE = 10V
40 0 0 2 4
Common Emitter o TC = 25 C
6
8
0 0.3
1
10
20
V CE , Collector-Emitter Voltage[V]
VCE, Collector-Emitter Voltage[V]
Fig 3. Saturation Voltage vs. Case Temperature at Variant Current Level
VCE, Collector-Emitter Voltage[V]
5
Com m on Em itter V G E = 15V
150A
Fig 4. Load Current vs. Frequency
120
V CC = 300V Load Current : peak of square wave
Load Current [A]
4 3
100 80 60 40 20
Duty cycle : 50% o T C = 100 C Power Dissipation = 130W
75A
2 1 0 0 50 100
o
I C = 40A
150
0 0.1
1
10
100
1000
T C , Case Tem perature[ C]
Frequency [Khz]
Fig 5. Saturation Voltage vs. VGE
VCE, Collector-Emitter Voltage[V]
Fig 6. Saturation Voltage vs. VGE
VCE, Collector-Emitter Voltage[V]
20 16 12 8 4
IC = 40A 150A 75A
20 16 12 8
150A
Common Emitter o TC = 25 C
Common Emitter o TC = 25 C
4
IC = 40A
75A
0 0 4 8 12 16 20
0 0 4 8 12 16 20
VGE, Gate-Emitter Voltage[V]
VGE, Gate-Emitter Voltage[V]
FP7G75US60 Rev. A
5
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FP7G75US60 Transfer Molded Type IGBT Module
Fig 7. Capacitance Characteristics
9000
Cies
Fig 8. Turn-On Characteristics vs. Gate Resistance
1000
Switching Time[ns]
Common Emitter VCC = 300V, VGE = +/- 15V IC = 75A TC = 25 C TC = 125 C
Tr
o o
Common Emitter VGE = 0V, f = 1MHz T C = 25 C
o
Capacitance[pF]
Ton
6000
Coes
100
3000
Cres
0 0.5
10
1 10 30
1
VCE, Collector-Emitter Voltage[V]
10 RG, Gate Resistance[]
Fig 9. Turn-Off Characteristics vs. Gate Resistance
5000
Switching Time[ns]
Common Emitter VCC = 300V, VGE = +/- 15V IC = 75A T C = 25 C T C = 125 C
o o
Fig 10. Switching Loss vs. Gate Resistance
100
Switching Loss[mJ]
Common Emitter VCC = 300V, VGE = +/- 15V IC = 75A
1000
Toff
10
TC = 25 C TC = 125 C
Eon
o
o
Tf
100
Tf
1
Eoff
10 1 10
RG, Gate Resistance[]
50
0.1 1 10 RG, Gate Resistance[]
Fig 11. Turn-On Characteristics vs. Collector Current 10000
1000
Common Emitter VCC = 300V, VGE = +/- 15V IC = 75A TC = 25 C TC = 125 C
o
Fig 12. Turn-Off Characteristics vs. Collector Current
Common Emitter VCC = 300V, VGE = +/- 15V IC = 75A TC = 25 C TC = 125 C
Toff
o o
Switching Time[ns]
100
Ton
Switching Time[ns]
o
1000
Tr
100
Tf
10
Tf
1 20
40 60 80 100 120 IC, Collector Current[A]
140
10 20
40
60 80 100 120 140 IC, Collector Current[A]
FP7G75US60 Rev. A
6
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FP7G75US60 Transfer Molded Type IGBT Module
Fig 13. Switching Loss vs. Collector
100
VGE, Gate-Emitter Voltage[V]
Common Emitter VCC = 300V, VGE = +/- 15V IC = 75A
Fig 14. Gate Charge Characteristics
15
300 V
12
200 V
Switching Loss[mJ]
10
TC = 25 C TC = 125 C
Eoff
o
o
9 6 3 0 0
V CC = 100 V
1
Eon
Common Emitter RL = 4 TC = 25 C
o
0.1 20
40
60 80 100 120 140 IC, Collector Current[A]
100
200
Q g, Gate Charge[nC]
Fig 15. SOA Characteristics
500
IC MAX. (Pulsed)
Fig 16. Turn-Off SOA Characteristics
IC, Collector Current[A]
IC MAX. (Continuous) 100us 1ms
50us
10
DC Operation
IC, Collector Current[A]
100
100
10
1
Single Nonrepetitive o Pulse TC = 25 C Curves must be derated linerarly with increase in temperature
0.1 0.3
1
10
100
1000
1 1 10
Safe Operating Area o VGE = 20V, TC = 100 C
100
1000
VCE, Collector-Emitter Voltage[V]
VCE, Collector-Emitter Voltage[V]
Fig 17. RBSOA Characteristics
Thermal Response, Zthjc[ C/W]
Fig 18. Transient Thermal Impedance
1
600
IC, Collector Current[A]
100
o
Single Nonrepetitive o Pulse TJ = 125 C VGE = 15V RG = 3.3
0.1
10
1
0.01
TC = 25 C IGBT : DIODE :
o
0.1
0
100 200 300 400 500 600 700
VCE, Collector-Emitter Voltage[V]
1E-3 -5 10
10 10 10 10 10 10 Rectangular Pulse Duration[sec]
-4
-3
-2
-1
0
1
FP7G75US60 Rev. A
7
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FP7G75US60 Transfer Molded Type IGBT Module
Fig 19. Forward Characteristics
200
IF, Forward Current[A]
Common Cathode VGE = 0V TC = 25 C TC = 125 C
o o
Fig 20. Reverse Recovery Characteristics
Irr, Peak Reverse Recovery Current[A] Trr, Reverse Recovery Time[x10ns]
30
Trr
150
10
Irr Trr Irr
100
50
Common Cathode di/dt = 150A/us o TC = 25 C TC = 100 C
o
0 0 1 2 3 4
VF, Forward Voltage[V]
1 0
20
40
60
80
IF, Forward Current[A]
FP7G75US60 Rev. A
8
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FP7G75US60 Transfer Molded Type IGBT Module
23.500.50
23.000.50
23.000.50
16.220.50
5.080.50
0.80+0.10 -0.05
18.400.50 14.50+0.50 -0.80
(5)
10.000.10
(R 2.7 5)
1.000.10
1
2
3
7
6 35.000.50
38.801.00
0) 1.0 (R
25.000.20
(14)
17.500.30
(14)
0 (9 )
5
4 10.000.50
(R
80.000.30 93.000.50
1. 65 )
9.600.10 12.200.30
(10.00) (6.50)
(7 )
(10.00) (14.00) (9.00) (14.00) (9.00) (14.00) (6.50)
10.400.30
(5)
FP7G75US60 Rev. A
9
12.200.30
www.fairchildsemi.com
FP7G75US60 Transfer Molded Type IGBT Module
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidianries, and is not intended to be an exhaustive list of all such trademarks. ACEx(R) Build it NowTM CorePLUSTM CorePOWERTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R) EfficentMaxTM EZSWITCHTM *
TM
(R)
Fairchild(R) Fairchild Semiconductor(R) FACT Quiet SeriesTM FACT(R) FAST(R) FastvCoreTM FlashWriter(R) *
tm
FPSTM F-PFSTM FRFET(R) Global Power ResourceSM Green FPSTM Green FPSTM e-SeriesTM GTOTM IntelliMAXTM ISOPLANARTM MegaBuckTM MICROCOUPLERTM MicroFETTM MicroPakTM MillerDriveTM MotionMaxTM Motion-SPMTM OPTOLOGIC(R) OPTOPLANAR(R)
(R)
tm
PDP-SPMTM Power-SPMTM PowerTrench(R) Programmable Active DroopTM QFET(R) QSTM Quiet SeriesTM RapidConfigureTM Saving our world 1mW at a timeTM SmartMaxTM SMART STARTTM SPM(R) STEALTHTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SuperMOSTM (R)
The Power Franchise(R)
tm
TinyBoostTM TinyBuckTM TinyLogic(R) TINYOPTOTM TinyPowerTM TinyPWMTM TinyWireTM SerDesTM
UHC(R) Ultra FRFETTM UniFETTM VCXTM VisualMaxTM
* EZSWITCHTM and FlashWriter(R) are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. This datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
Rev. I34
Preliminary
First Production
No Identification Needed Obsolete
Full Production Not In Production
FP7G75US60 Rev. A
10
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